ET-250 Thermal Pad

thermal transfer pad

Brief introduction
ET-250 is thermal pad 2.5mm .The thermal Silicone Pad is using silicone as basic material, adding metal oxides and other auxiliary materials, synthesized by a special process.This thermally conductive pad is dedicated to the design of the gap heat transfer production, to fill the gap, heat transfer between the heating part and the radiating part. but also played insulation, damping and sealing effect, can meet the design requirements of equipment miniaturization and ultra-thin, futhermore wide range of thickness, excellent thermal conductivity of a filling material.
Application field :
Uses in electronic electric appliance products and so in product control motherboard, TFT-LCD, notebook, high efficiency power source, LED decorative lighting, has the heat conduction, the packing, the buffer action.
Feature:
1.The material is soft, good compression performance, thermal transfer and insulation performance is good
2. wide range of thickness, suitable for filling the cavity
3. Two sides with a natural viscosity, Self-adhesive and rebound,Strong operability and maintainability
4.The thermal conductivity is adjustable, From 1.0W/m.Kto 9.0 W/m.K

Other

Die-cut as drawing,optional both side with backing glue,optional thickness 0.2mm to 15mm,other colors

Thermal pad 2.5mm

Unit

Data

Test  Method

Color

-----

Gray,blue,White

 Visual

Thickness

mm

2.5mm

ASTM D374

Standard size

mm

200×400

ASTM D1204

Hardness

Shore A

55

ASTM D2240

Elongation

%

30

ASTM D412

Breakdown Voltage

Kv/mm

≥6.0

ASTM D149

Use Temp

 -40~220

EN344

Flame Rating

------

94V-0

UL 94

Thermal Conductivity

W/m.k

1.5~5

ASTM E 1461-01

Down load data sheet of ET250 Thermal pad 2.5mm

If you need other thickness,please see below link

Thermal pad Thickness catologue